DCS 150 Diamond Cutting Machine
Synova S.A., a leading manufacturer of diamond sawing systems, is now selling its newest model, DCS 150. This is a smaller system that will complement it’s DSC 300 series.
“Equipped with a 40 micron nozzle, the DCS is the perfect sawing tool for goods in the 2-grain to 3-carat range,” said Joerg Pausch, Synova’s diamond business director. “All the DCS machines incorporate Synova’s novel Laser MicroJet technology that generates a parallel laser beam within a micro jet of water, resulting in straight walls, tight kerf widths and smooth sawing surfaces, higher yields and a significant reduction in weight loss,” added Pausch.
Both the DCS 300 and DCS 150 integrate “Pie Sawing” capabilities that enable the user to perform a partial pie cut in one setup. This completely eliminates the usual resetting of the stone. This allows manufacturers to benefit greatly because this can be used across multiple industries that need high precision work.
Synova has had much success in countries such as India and Belgium, and has expanded into Russia recently. It plans to continue its operations in other parts of the globe such as Botswana and South Africa.